Condition for package mounting
Condition for package mounting
* Pb-Free recommended profile conditions
1. Reflow Soldering (max 2 times)
2. Flow Soldering (max 1 time)
Note: For double-wave soldering, the peak time is the total of two peaks (maximum temperature).
3. Manual Soldering
| Iron tip temp./time | max 400℃ / within 3s |
|---|---|
| times | max2 |
This profile gives recommended values, which are not guaranteed.
For mounting the package, evaluate the profile with the equipment, conditions, and materials to be used.
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